- Brand: GMB
- Product Code: TG-G3.0-01
- Availability: In Stock
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Heatsink thermal paste grease, 3 g weight
- Thermal compund (grease) for heatsinks
- Helps the heat dissipation from a CPU, chipset or processor to a heatsink
- Excellent thermal impedance
- Perfect stability - will not separate, run, migrate, or bleed
- Non capacitive or electrically conductive
OPERATING ENVIROMENT | |
Operating Temperature | -50 ~ 240 ° C |
General | |
Color | Grey |
Composites | 50% silicone compounds |
Compounds | 30% of carbon |
Density | > 2.5 |
Dissipation Factor | <0.005 |
Evaporation | <0.001 % |
The compounds of metal oxides | 20% |
The dielectric constant | > 5.1 |
Thermal conductivity | > 4.5 W / mK |
Thermal Impedance | <0.205 ° C-in2 / W |
Thixotropic index | 310 ± 10 ° C |
Viscosity | 76 CPS |
Volatility | <0.005 % |
Weight | 3 g |